Interaction of Silver Nanopowder with Copper Substrate

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Authors

SOPOUŠEK Jiří BURŠÍK Jiří ZÁLEŠÁK Jakub BURŠÍKOVÁ Vilma BROŽ Pavel

Year of publication 2011
Type Article in Periodical
Magazine / Source SCIENCE OF SINTERING
MU Faculty or unit

Faculty of Science

Citation
Web Science of Sintering
Field Physical chemistry and theoretical chemistry
Keywords Silver Copper Sintering DSC Indentation MELTING POINT PARTICLES TEMPERATURE TIN
Attached files
Description Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
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