Stabilita nanočástic cínu, mědi a stříbra

Investor logo

Warning

This publication doesn't include Faculty of Economics and Administration. It includes Faculty of Science. Official publication website can be found on muni.cz.
Title in English Stability of Tin, Copper and Silver Nanoparticles
Authors

BROŽ Pavel SOPOUŠEK Jiří

Year of publication 2009
Type Article in Proceedings
Conference 31. Mezinárodní slovenský a český kalorimetrický seminář
MU Faculty or unit

Faculty of Science

Citation
Field Physical chemistry and theoretical chemistry
Keywords Calorimetry; thermal analysis; X-ray diffraction analysis; transmission electron microscopy; CALPHAD
Description The contribution deals with experimental and theoretical study of tin, copper and silver nanoparticles as potential candidates for lead-free soldering at higher temperatures. Techniques of DSC, RTG diffraction analysis and transmission electron microscopy were used for investigation of melting point depression and surface effects and the results were supported by phase diagram calculations based on CAPLHAD method.
Related projects:

You are running an old browser version. We recommend updating your browser to its latest version.