Stabilita nanočástic cínu, mědi a stříbra
| Title in English | Stability of Tin, Copper and Silver Nanoparticles |
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| Authors | |
| Year of publication | 2009 |
| Type | Article in Proceedings |
| Conference | 31. Mezinárodní slovenský a český kalorimetrický seminář |
| MU Faculty or unit | |
| Citation | |
| Field | Physical chemistry and theoretical chemistry |
| Keywords | Calorimetry; thermal analysis; X-ray diffraction analysis; transmission electron microscopy; CALPHAD |
| Description | The contribution deals with experimental and theoretical study of tin, copper and silver nanoparticles as potential candidates for lead-free soldering at higher temperatures. Techniques of DSC, RTG diffraction analysis and transmission electron microscopy were used for investigation of melting point depression and surface effects and the results were supported by phase diagram calculations based on CAPLHAD method. |
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