Analytical Electron Microscopy of Lead-free Nanopowder Solders

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Authors

BURŠÍK Jiří SOPOUŠEK Jiří ZÁLEŠÁK Jakub BURŠÍKOVÁ Vilma

Year of publication 2010
Type Article in Proceedings
Conference NANOCON 2010, 2ND INTERNATIONAL CONFERENCE
MU Faculty or unit

Faculty of Science

Citation
Web http://www.nanocon.eu/files/proceedings/nanocon_10/lists/papers/456.pdf
Field Thermodynamics
Keywords solder; nanopowder; nanoindentation; temperature
Description In this work we study the quality of bulk materials produced of Ag nanopowders annealed at various temperatures. Ag nanoparticles were studied in a transmission electron microscope. Sandwich structures were prepared of Cu disks and a layer of Ag nanopowder. The sandwiches were annealed in the range from 200 to 350 oC, metallographic cross sections were prepared from annealed samples and the microstructure and quality of joints was studied by analytical electron microscopy and depth sensing indentation technique.
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